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Title:
赤外線処理方法及び処理体の製造方法
Document Type and Number:
Japanese Patent JP6652831
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To allow infrared rays to easily reach depths of a coating film when infrared ray processing is performed.SOLUTION: Provided is an infrared ray processing method with which a coating film comprising at least a liquid and particles is irradiated with an infrared ray for infrared ray processing, including a step of projecting an infrared ray onto a coating film such that at least a portion of a radiation half-value width region H which is a half-value width region of a wavelength with the radiation intensity of the radiation peak of the infrared ray projected onto the coating film as a reference is superposed on a portion of a particular wavelength region A in which the wavelength λ satisfies λ≤1.2x and 1.0 μm≤λ≤10 μm, where the average particle diameter of particles is x[μm], and the wavelength of the infrared ray is λ[μm].SELECTED DRAWING: Figure 4

Inventors:
Yoshio Kondo
Michio Aoki
Application Number:
JP2015248318A
Publication Date:
February 26, 2020
Filing Date:
December 21, 2015
Export Citation:
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Assignee:
Nippon Insulator Co., Ltd.
International Classes:
F26B3/30; B05D3/00; B05D3/02; B05D7/24; F26B23/04
Domestic Patent References:
JP2010237479A
JP8076586A
JP2014104404A
JP8052413A
Foreign References:
WO2015083839A1
WO2014168229A1
Attorney, Agent or Firm:
Aitec International Patent Office