Title:
射出成形用金型
Document Type and Number:
Japanese Patent JP7141609
Kind Code:
B2
Abstract:
To improve a molding accuracy of a molded product.SOLUTION: There is provided a mold for injection molding, the mold having a fixed mold 3 and a movable mold 2, and forming a cavity to be filled with a molten resin by being butted against each other, in which a movable pin 15 that can move in an axial direction is provided inside and outside the cavity, and a tip of the movable pin is located in the cavity filled with the molten resin and is provided as a hole forming portion 16 for forming a molding hole in the molded product. Thus, in a state where the cavity is filled with the molten resin, the hole forming part of the movable pin is located in the cavity, and a molded hole 401 is formed in the molded product by pulling out the hole forming part from the solidified molten resin, and therefore pressure to the movable pin in a direction in which the molten resin causes the movable pin to fall is hardly applied, and improvement of a molding accuracy of the molded product can be achieved.SELECTED DRAWING: Figure 6
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Inventors:
Wataru Shimonuzono
Suzuki Tadao
Takayuki Fujitani
Suzuki Tadao
Takayuki Fujitani
Application Number:
JP2020034046A
Publication Date:
September 26, 2022
Filing Date:
February 28, 2020
Export Citation:
Assignee:
Futaba Electronics Co., Ltd.
International Classes:
B29C45/26; B29C45/27; B29C45/28; B29C45/56
Domestic Patent References:
| JP2004025527A | ||||
| JP10024455A | ||||
| JP2010058461A | ||||
| JP2020104438A | ||||
| JP2003245951A | ||||
| JP2000202865A |
Attorney, Agent or Firm:
Patent Attorney Corporation Technopia International Patent Office
Masanobu Iwata
Hiroto Nakagawa
Masanobu Iwata
Hiroto Nakagawa