Title:
SURFACE MOUNTING LINE SURVEY INSTRUMENT AND QUALITY MANAGEMENT SYSTEM
Document Type and Number:
Japanese Patent JP2018025481
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a technology to achieve a survey of a surface mounting line with an actual position of a land as a reference.SOLUTION: A survey instrument comprises: an imaging part that picks up an image of a substrate 40 in a state where solder 46 is printed on a land 43, a state where a part is mounted on solder, or a state where a part is joined to a land by solder; a land specification part that recognizes the position of a component 44 of the substrate other than the land from an image 42 of the substrate acquired by the imaging part, and specifies the position of the land included in the image on the basis of the recognized position of the component; and a surveying part that conducts a survey of the solder or the part on the land with the position of the land specified by the land specification part as a reference.SELECTED DRAWING: Figure 4
Inventors:
MORI HIROYUKI
KISHIMOTO MAYUKO
FUJII SHINPEI
NAKAJIMA KATSUKI
KISHIMOTO MAYUKO
FUJII SHINPEI
NAKAJIMA KATSUKI
Application Number:
JP2016157876A
Publication Date:
February 15, 2018
Filing Date:
August 10, 2016
Export Citation:
Assignee:
OMRON TATEISI ELECTRONICS CO
International Classes:
G01N21/956; H05K13/08
Domestic Patent References:
| JP2011153893A | 2011-08-11 | |||
| JP2006317266A | 2006-11-24 | |||
| JP2015142032A | 2015-08-03 | |||
| JPWO2014049872A1 | 2016-08-22 |
Attorney, Agent or Firm:
Kazunobu Sera
Yoshiyuki Kawaguchi
Hiroyasu Kanai
Takehiko Sekine
Takeshi Nakamura
Katsuhiko Imahori
Hironobu Yazawa
Yoshiyuki Kawaguchi
Hiroyasu Kanai
Takehiko Sekine
Takeshi Nakamura
Katsuhiko Imahori
Hironobu Yazawa