Title:
Board inspection method, computer storage medium and board inspection device
Document Type and Number:
Japanese Patent JP6329923
Kind Code:
B2
Abstract:
A method of inspecting a substrate to be repeatedly treated along a predetermined transfer way in a plurality of kinds of different treatment apparatuses, includes: imaging a substrate that has been treated in one of the treatment apparatuses, to acquire a first substrate image; imaging a substrate that has been an object for imaging the first substrate image and further treated in another treatment apparatus different from the one treatment apparatus after treated in the one treatment apparatus, to acquire a second substrate image; then performing defect inspection, based on the first substrate image and the second substrate image; and identifying, depending on whether or not a defect detected from the second substrate image is not detected from the first substrate image, whether or not the defect is caused by a treatment after the first substrate image is acquired and a treatment before the second substrate image is acquired.
Inventors:
Takuya Mori
Makoto Hayakawa
Makoto Hayakawa
Application Number:
JP2015115941A
Publication Date:
May 23, 2018
Filing Date:
June 08, 2015
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
G01N21/956; H01L21/66
Domestic Patent References:
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| JP2000200356A | ||||
| JP2012104593A | ||||
| JP2008164336A | ||||
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| JP2010165876A | ||||
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Attorney, Agent or Firm:
Tetsuo Kanamoto
Miaki Kametani
Koji Hagiwara
Naoki Ogita
Miaki Kametani
Koji Hagiwara
Naoki Ogita
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