An inspection method of electrode structure

Title:

An inspection method of electrode structure

Document Type and Number:

Japanese Patent JP5939003

Kind Code:

B2

Abstract:

PROBLEM TO BE SOLVED: To provide an inspection method of an electrode structure capable of inspecting a defect on a side surface of an electrode.SOLUTION: An electrode structure 10 includes: a semiconductor layer 11; a plurality of first electrodes 12a, 12b and 12c disposed in the semiconductor layer, extending in a thickness direction of the semiconductor layer, and having a cutting line L capable of cutting the first electrodes 12a and 12b in the thickness direction of the semiconductor layer without cutting at least one first electrode 12c in the plurality of first electrodes; and a first conductive layer 13 respectively connecting with the plurality of first electrodes. In an inspection method of an electrode structure, the electrode structure 10 is cut by the cutting line L, and while scanning a cutting surface of a part of the electrode structure including the at least one first electrode 12c which has not been cut by using electromagnetic waves having wavelength passing through the semiconductor layer 11, electric power is supplied to the first conductive layer 13, thereby detecting resistance change of the first electrode exposed on the cutting surface and the first electrode which is not exposed.

Inventors:

Mizushima Kenko

Application Number:

JP2012089444A

Publication Date:

June 22, 2016

Filing Date:

April 10, 2012

Export Citation:

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