Title:
センサモジュールの検査方法、及び、センサモジュール検査装置
Document Type and Number:
Japanese Patent JP4909253
Kind Code:
B2
Abstract:
The present invention provides, as one aspect, an apparatus for inspecting a sensor module (10) including at least one held sensor in a housing having a plurality of outer surfaces. The held sensor detects acceleration or angular velocity. The apparatus includes a holding unit (2) that has an apparatus-side surface and holds the housing in a state where one of the outer surfaces of the housing serving as a housing-side surface contacts the apparatus-side surface, a driving unit (4) that moves the holding unit, a first obtaining unit that, in a state where the housing-side surface contacts the apparatus-side surface, obtains an output from the held sensor, at least one reference sensor (6) that has a detection axis and is provided such that a direction of the detection axis matches a direction of a reference axis of the held sensor, and a second obtaining unit that obtains an output from the reference sensor.
Inventors:
Hiroshi Kobayashi
Hyakki Masaki
Nobuhiro Takano
Hyakki Masaki
Nobuhiro Takano
Application Number:
JP2007332444A
Publication Date:
April 04, 2012
Filing Date:
December 25, 2007
Export Citation:
Assignee:
株式会社デンソー
International Classes:
G01P21/00; G01M99/00; G01P21/02
Domestic Patent References:
| JP2001305156A | ||||
| JP2007178402A | ||||
| JP2004347587A | ||||
| JP6242077A |
Attorney, Agent or Firm:
Takashi Ito
Daito Kato
Ryo Iguchi
Hirohiko Usui
Daito Kato
Ryo Iguchi
Hirohiko Usui