Title:
モジュール式充填材形成連結組立品の設置システム
Document Type and Number:
Japanese Patent JP2008506869
Kind Code:
A
Abstract:
A system for the placement of modular fill material forming co-joined assemblies that promotes increased efficiency in fill material building methods by utilizing the capabilities of aerial conveyance devices, the pre-assembly of forms, the rapid bracing of forms, and the sequential placement of enclosure forms.
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Inventors:
Barnet, Robert Tee.
Barnet, Bradley Jay.
Dowerks, Donald H.
Barnet, Bradley Jay.
Dowerks, Donald H.
Application Number:
JP2007521701A
Publication Date:
March 06, 2008
Filing Date:
July 15, 2005
Export Citation:
Assignee:
Thermoformed Block Corporation
International Classes:
E04G9/00; E04B2/86; E04G11/06; E04G21/14
Attorney, Agent or Firm:
Hidesaku Yamamoto
Takaaki Yasumura
Natsuki Morishita
Takaaki Yasumura
Natsuki Morishita