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Title:
DIELECTRIC MATERIAL COMPOSITION AND INSULATING FILM AND CIRCUIT BOARD INCLUDING THE SAME
Document Type and Number:
Japanese Patent JP2018016780
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a dielectric material which has a low specific dielectric constant and a low dielectric loss tangent, is excellent in heat resistance and has high adhesiveness.SOLUTION: A dielectric material contains a biphenyl aralkyl resin derivative, where in the biphenyl aralkyl resin, a part of a hydroxyl group is replaced with a double bond. There are also provided an insulating film and a circuit board including the dielectric material composition. The dielectric material can provide a dielectric material which has a sufficiently stable crosslinked structure, has a low specific dielectric constant and a low dielectric loss tangent, is excellent in heat resistance, has high adhesiveness, and enables high-frequency application.SELECTED DRAWING: None

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Inventors:
SU HUNG-WEN
YANG MIN CHI
CHANG CHIN JUNG
HSU LI CHE
CHIN BUNSHO
Application Number:
JP2016176049A
Publication Date:
February 01, 2018
Filing Date:
September 09, 2016
Export Citation:
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Assignee:
TAIWAN TAIYO INK CO LTD
International Classes:
C08L65/00; C08G61/00; C08L9/00; C08L63/00; H01B3/40; H01B3/44; H05K1/03
Domestic Patent References:
JP2014169428A2014-09-18
JP2015137344A2015-07-30
JP2012017423A2012-01-26
JP2003082067A2003-03-19
Foreign References:
WO2014123051A12014-08-14
Attorney, Agent or Firm:
Junya Tanaka
Mizuya Kamiya



 
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