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Title:
The internal pressure decompression method of an encapsulated type switch and an encapsulated type switch
Document Type and Number:
Japanese Patent JP6005991
Kind Code:
B2
Abstract:
A movable board provided with movable contact points 54 is arranged inside a switch case 3 formed by overlap of a substrate 10 provided with fixed contact points 20 and a lid body 35. A top end surface of the substrate 10 is provided with a concave streak portion 47e and a ring groove 30 for accommodating a seal ring 31, wherein a projecting streak portion 40 provided on a lower surface of a flange portion 38 in the lid body 35 is fitted in the concave streak portion 47e for welding. A seal bearing 47 mounted to shaft holes 15 provided on an opposing portion between the substrate 10 and the lid body 35 comprises a cylindrical body portion 47a fitted in at least one of the shaft holes 15, and a lip-shaped seal portion 47b extending to a side of a rotary surface of a shaft portion from an inner peripheral surface of the body portion 47a to make flexible contact with the rotary surface. An air in the switch case 3 is discharged to an outside (atmosphere) by the seal portion 47b flexibly deflected by a negative pressure through the shaft hole.

Inventors:
Tetsuya Inozuka
Application Number:
JP2012114000A
Publication Date:
October 12, 2016
Filing Date:
May 18, 2012
Export Citation:
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Assignee:
Valeo Japan Co., Ltd.
International Classes:
H01H21/02; H01H21/08
Domestic Patent References:
JP2106646U
JP2004241144A
JP2010257785A
JP1135622U
JP11053990A
JP2010049887A
JP2072527A
Foreign References:
US6518522
Attorney, Agent or Firm:
Naohiko Takehara
Kimio Kikutani
Tetsuro Maki
Maki Reiko
Kazutaka Hara



 
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