Title:
INTERNAL TEMPERATURE MEASUREMENT DEVICE, INTERNAL TEMPERATURE MEASUREMENT METHOD, AND INTERNAL TEMPERATURE MEASUREMENT PROGRAM
Document Type and Number:
Japanese Patent JP2017161394
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an internal temperature measurement device, internal temperature measurement method, and internal temperature measurement program capable of measuring the internal temperature without filling temperature detecting means into a mold resin and without decreasing the dielectric strength of the resin.SOLUTION: An internal temperature measurement device measures the internal temperature of a measuring object (ground coil C) that includes a heat source inside it and a mold resin 3 covering the surface of the heat source. The internal temperature measurement device includes: a temperature sensor 10 for measuring the surface temperature; a heat flow sensor 11 for measuring the heat flow rate of the surface; and a calculation unit 20 for calculating the internal temperature of the measuring object on the basis of the measured values by the temperature sensor 10 and heat flow sensor 11, the thickness of the mold resin 3 covering the measuring object, and the thermal conductivity of the mold resin 3.SELECTED DRAWING: Figure 1
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Inventors:
TANAKA MINORU
Application Number:
JP2016046906A
Publication Date:
September 14, 2017
Filing Date:
March 10, 2016
Export Citation:
Assignee:
RAILWAY TECHNICAL RES INST
International Classes:
G01K7/00
Attorney, Agent or Firm:
Masatake Shiga
Tadashi Takahashi
Suzuki Mitsuyoshi
Yasuhiko Murayama
Tadashi Takahashi
Suzuki Mitsuyoshi
Yasuhiko Murayama