MEMSに関してのまたは小型封入デバイスに関しての密封試験 - COMPAGNIE GENERALE DES MATIERES NUCLEAIRES

Title:

MEMSに関してのまたは小型封入デバイスに関しての密封試験

Document Type and Number:

Japanese Patent JP2008504549

Kind Code:

A

Abstract:

A tightness testing method for a MEMS or small encapsulated component, the MEMS or small component being housed in a cavity of a carrier. The cavity being sealed and containing a gas having a different density to the density it would have if subjected to the pressure of the medium outside the cavity. The method measures the density of the gas contained in the cavity.

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Inventors:

Francois de Crécy
Bernard Deam

Application Number:

JP2007518667A

Publication Date:

February 14, 2008

Filing Date:

June 29, 2005

Export Citation:

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