Title:
A joining method using a laser beam
Document Type and Number:
Japanese Patent JP6046329
Kind Code:
B2
Abstract:
The invention discloses a bonding method using laser, wherein a first part and a second part are engaged by laser without the melting or decomposition of the pattern layer so as to make the appearance thereof more beautiful. The pattern layer 4 is non-permeability for laser. An intermediate part 5 for being bonded by laser is arranged adjacent to the pattern layer 4. Laser L with a temperature no more than the melting or decomposition temperature of the pattern layer 4 is irradiated on the pattern layer 4 for heating the pattern layer. The heat of the pattern layer 4 is used for heating the intermediate part 5.
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Inventors:
Kosaku Yamada
Hirofumi Murakami
Kazuya Fujita
Hirofumi Murakami
Kazuya Fujita
Application Number:
JP2010252765A
Publication Date:
December 14, 2016
Filing Date:
November 11, 2010
Export Citation:
Assignee:
Hayakawa Rubber Co., Ltd.
International Classes:
B29C65/16; B23K26/21; B23K26/32
Domestic Patent References:
| JP2009119807A | ||||
| JP2009173023A | ||||
| JP2007112126A | ||||
| JP2004322335A | ||||
| JP200796069A | ||||
| JP2001198982A | ||||
| JP5253968A | ||||
| JP2007276305A | ||||
| JP52155663A | ||||
| JP2008230163A | ||||
| JP20087584A | ||||
| JP2009269401A | ||||
| JP20087584A |
Foreign References:
| WO2008044349A1 |
Attorney, Agent or Firm:
Maeda patent office