The joining structure object of an insulating board and a condensator, its manufacturing method, a power semiconductor module, and a manufacturing method for the same

Title:

The joining structure object of an insulating board and a condensator, its manufacturing method, a power semiconductor module, and a manufacturing method for the same

Document Type and Number:

Japanese Patent JP6221590

Kind Code:

B2

Abstract:

PROBLEM TO BE SOLVED: To provide a junction structure of an insulation substrate and a cooler, the junction structure having a high resistance with respect to a hot-cold cycle stress in which temperature difference is large, a manufacturing method of the junction structure, a power semiconductor module, and a manufacturing method of the power semiconductor module.SOLUTION: A junction structure includes an insulation substrate 200 consisting of: a ceramic substrate 11; an upper circuit metal plate 13 bonded to an upper surface of the ceramic substrate 11; and a lower circuit metal plate 12 bonded to a lower surface of the ceramic substrate 11. Further, the junction structure has: a metal cooler 100; and an ultrahigh temperature bonding layer 10 which bonds the lower circuit metal plate 12 and the cooler 100 between the insulation substrate 200 and the cooler 100 and has an area smaller than that of the lower circuit metal plate 12 in a planar view. A groove frame 17 is formed on a bonding surface of the cooler with the ultrahigh temperature bonding surface along a periphery of the ultrahigh temperature bonding surface. The groove frame 17 has a shape which suppresses wet-spreading generated during formation of the ultrahigh temperature bonding surface 10 so that the ultrahigh temperature bonding surface 10 is formed in the reduced similar shape with respect to the lower circuit metal plate 12 in a planar view.

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Inventors:

Kenta Suzuki
Satoshi Tanimoto

Application Number:

JP2013206910A

Publication Date:

November 01, 2017

Filing Date:

October 02, 2013

Export Citation:

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Assignee:

Nissan Motor Co., Ltd

International Classes:

H01L23/373; H01L21/60; H01L23/36; H01L25/07; H01L25/18

Domestic Patent References:

JP2012142465A
JP2001168250A
JP60061740U
JP2003017627A
JP2013191640A
JP2006140402A

Attorney, Agent or Firm:

Hidekazu Miyoshi
Iwa Saki Kokuni
Shunichi Takahashi
Masakazu Ito
Toshio Takamatsu

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