Title:
A jointing material and a joining method using it
Document Type and Number:
Japanese Patent JP5976684
Kind Code:
B2
Abstract:
The occurrence of uneven drying in the center and end of a surface of a bonding layer during a desolvation process of a pre-drying step is reduced to ensure highly reliable bonding without peeling of a bonding surface even after repeated exposure to heat shock after bonding. The bonding material of the present invention to achieve the object contains silver nanoparticles coated with organic substance having 6 or less carbon atoms and having an average primary particle diameter of 10 to 30 nm as main silver particles, silver nanoparticles coated with an organic substance having 6 or less carbon atoms and having an average primary particle diameter of 100 to 200 nm as secondary silver particles, two kinds of solvents having different boiling points, and a dispersant.
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Inventors:
Keiichi Endo
Kurita Satoshi
Minami Nagaoka
Kurita Satoshi
Minami Nagaoka
Application Number:
JP2013554173A
Publication Date:
August 24, 2016
Filing Date:
January 20, 2012
Export Citation:
Assignee:
dowa Electronics Co., Ltd.
International Classes:
B22F1/052; B22F1/054; B22F1/102; B22F7/06; B22F9/00; H01B1/00; H01B1/22
Domestic Patent References:
| JP2008258147A | ||||
| JP2010229544A | ||||
| JP2011080147A |
Attorney, Agent or Firm:
Masaki Hiroyuki