Title:
A lamination wiring film for electronic parts, and sputtering target material for enveloping layer formation
Document Type and Number:
Japanese Patent JP6037208
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a laminated wiring film for an electronic component in which moisture resistance and oxidation resistance are improved, and further, low electric resistance value can be maintained even if the coating layer is passed through a heating step when it is laminated with Cu which is the main conductive layer having low resistance, and a sputtering target material for forming a coating layer.SOLUTION: The laminated wiring film for an electronic component obtained by forming a metal film on a substrate is composed of the main conductive layer essentially consisting of Cu and/or a coating layer of coating either side and/or the other side of the conductive layer. In the coating layer, compositional formula in atomic ratio is represented by Mo-NiTi(10≤x≤50, 3≤y≤30 and x+y≤53), and the balance comprises inevitable impurities.
Inventors:
Hideo Murata
Application Number:
JP2012168042A
Publication Date:
December 07, 2016
Filing Date:
July 30, 2012
Export Citation:
Assignee:
Hitachi Metals Co., Ltd.
International Classes:
C23C14/14; C22C27/04; C22C30/00; C23C14/34; H01L21/28; H01L21/285; H01L21/3205; H01L21/768; H01L23/532
Domestic Patent References:
| JP2010132974A | ||||
| JP2004140319A | ||||
| JP2005125721A | ||||
| JP2005289046A | ||||
| JP2000144380A | ||||
| JP2006040589A |