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Title:
【発明の名称】半導体製造方法
Document Type and Number:
Japanese Patent JP3015710
Kind Code:
B2
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Inventors:
Naoto Miyashita
Koichi Takahashi
Hiroshi Kinoshita
Application Number:
JP14199495A
Publication Date:
March 06, 2000
Filing Date:
June 08, 1995
Export Citation:
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Assignee:
Toshiba Corporation
International Classes:
H01L21/31; C23C16/34; C23C16/46; H01L21/205; H01L21/318; (IPC1-7): H01L21/31; C23C16/34; C23C16/46; H01L21/205; H01L21/318
Domestic Patent References:
JP6058608A
JP54160172A
JP61267315A
JP57133623A
JP58127331A
Attorney, Agent or Firm:
Takehiko Suzue



 
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