A laser beam machining device provided with the interference evasion function at the time of nozzle approach

Title:

A laser beam machining device provided with the interference evasion function at the time of nozzle approach

Document Type and Number:

Japanese Patent JP6017528

Kind Code:

B2

Inventors:

Hiroaki Tokito

Application Number:

JP2014263248A

Publication Date:

November 02, 2016

Filing Date:

December 25, 2014

Export Citation:

Assignee:

FANUC Corporation

International Classes:

B23K26/00; B23K26/02

Domestic Patent References:

Attorney, Agent or Firm:

Atsushi Aoki
Tetsuro Shimada
Shinji Mitsuhashi
Hirose Shigeki
Kazuo Maejima
Masahiro Tahara

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