Title:
LASER PULSE CUTOUT APPARATUS AND LASER CUTOUT METHOD
Document Type and Number:
Japanese Patent JP2018094576
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a laser pulse cutout apparatus capable of more finely adjusting a laser irradiation condition.SOLUTION: A beam deflector turns entering laser beams to a processing route directing to a processing object on command from outside. A controller has the function of cutting out a plurality of laser pulses with different pulse widths and pulse energies toward the processing route from one primitive laser pulse entering the beam deflector by giving command to the beam deflector.SELECTED DRAWING: Figure 1
Inventors:
KAWAMURA JOICHI
OKUDAIRA YASUYUKI
OKUDAIRA YASUYUKI
Application Number:
JP2016239966A
Publication Date:
June 21, 2018
Filing Date:
December 12, 2016
Export Citation:
Assignee:
SUMITOMO HEAVY INDUSTRIES
International Classes:
B23K26/0622; B23K26/00; B23K26/082; B23K26/382; H05K3/00
Attorney, Agent or Firm:
Mikio Kuruyama
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