Title:
発光素子パッケージ
Document Type and Number:
Japanese Patent JP7252597
Kind Code:
B2
Abstract:
A light emitting device package according to the embodiment includes: a first frame including a first opening part provided through an upper surface and a lower surface of the first frame, and a second frame spaced apart from the first frame and including a second opening part; first and second conductive layers disposed in the first and second opening parts, respectively; a body disposed between the first and second frames; a first resin disposed on the body; and a light emitting device disposed on an adhesive. The light emitting device according to the embodiment includes a first bonding part electrically connected to the first frame and a second bonding part electrically connected to the second frame and spaced apart from the first bonding part, the first and second bonding parts are disposed on the first and second opening parts, respectively, and a first alloy layer formed of an alloy of the first conductive layer and the first frame is disposed between the first conductive layer and the first frame.
Inventors:
Im chanman
Kim, Kisoku
Kim, Won Joon
Sung, Juno
Kim, Kisoku
Kim, Won Joon
Sung, Juno
Application Number:
JP2018517427A
Publication Date:
April 05, 2023
Filing Date:
September 29, 2017
Export Citation:
Assignee:
Sujo Lekin Semiconductor Company Limited
International Classes:
H01L33/62
Domestic Patent References:
| JP2015226056A | ||||
| JP2010239105A | ||||
| JP2009545180A | ||||
| JP2008311584A | ||||
| JP2002076055A | ||||
| JP2012033724A | ||||
| JP2013219090A | ||||
| JP2012518291A | ||||
| JP2017059758A | ||||
| JP2015185820A | ||||
| JP2007116165A | ||||
| JP2016184656A | ||||
| JP2011151069A |
Foreign References:
| US20120181555 | ||||
| US20130193464 |
Attorney, Agent or Firm:
Sachiko Takeda