Title:
発光素子パッケージ
Document Type and Number:
Japanese Patent JP7266316
Kind Code:
B2
Abstract:
Embodiments provide a light emitting device package including a package body having a through-hole; a radiator disposed in the through-hole and including an alloy layer having Cu; and a light emitting device disposed on the radiator, wherein the alloy layer includes at least one of W or Mo, and wherein the package body includes cavity including a sidewall and a bottom surface, and wherein the through-hole is formed in the bottom surface.
Inventors:
Kim Beyonmoku
John Sujeong
Moon Youngte
Cho Yong Jun
Hwang Sung Kyo
Kwon So Young
John Sujeong
Moon Youngte
Cho Yong Jun
Hwang Sung Kyo
Kwon So Young
Application Number:
JP2021171970A
Publication Date:
April 28, 2023
Filing Date:
October 20, 2021
Export Citation:
Assignee:
Sujo Lekin Semiconductor Company Limited
International Classes:
F21S41/148; H01L33/62; F21V19/00; F21V23/00; F21V25/10; F21V29/503
Domestic Patent References:
| JP2010274256A | ||||
| JP2006128701A | ||||
| JP2007123482A |
Foreign References:
| US20110133242 |
Attorney, Agent or Firm:
Sachiko Takeda