Title:
発光装置
Document Type and Number:
Japanese Patent JP7116333
Kind Code:
B2
Abstract:
To provide a light-emitting device capable of detecting abnormality causing leakage of laser light more reliably.SOLUTION: A light-emitting device comprises a package body 11, a translucent lid part 12 fixed to the package body directly or indirectly, a semiconductor laser element 13 placed in a space surrounded by the package body and the translucent lid part, a wavelength conversion member 14 placed on the path of light from the semiconductor laser element, above the translucent lid part, wiring 15 provided on the light incident surface 14I side of the wavelength conversion member where laser light, emitted from the semiconductor laser element, is incident, a conductive layer 16 electrically connected with the wiring 15, and placed on the top face of the translucent lid part, an opaque insulation member 17 covering the conductive layer and the translucent lid part, and electrodes 18a, 18b placed outside the insulation member, on the surface of the package body, and electrically connected with the conductive layer.SELECTED DRAWING: Figure 1C
Inventors:
Tadashi Kitajima
Application Number:
JP2020077228A
Publication Date:
August 10, 2022
Filing Date:
April 24, 2020
Export Citation:
Assignee:
Nichia Corporation
International Classes:
H01S5/0239; F21S2/00; F21V9/32; F21V23/00; F21V25/02
Domestic Patent References:
| JP2014165450A | ||||
| JP2016122715A | ||||
| JP2017085036A | ||||
| JP2009060113A | ||||
| JP2015060159A |
Foreign References:
| US20180003355 |
Attorney, Agent or Firm:
Shinki Global IP Patent Corporation
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