Title:
発光素子、直下式バックライトモジュール、側光式バックライトモジュール、板状ランプ、並びに、ストリップ状発光素子
Document Type and Number:
Japanese Patent JP5922081
Kind Code:
B2
Abstract:
A luminous element includes a heat dissipation plate, a body, a plurality of LED chips, a first connector and a second connectors. The heat dissipation plate includes a die-bonding area and a heat dissipation area opposite to the die-bonding area. The body surrounds the heat dissipation plate, and includes a first body surface and a second body surface opposite to the first body surface. The first body surface includes a concave part exposing the die-bonding area. The second body surface includes an opening exposing the heat dissipation area. The LED chips are mounted on the die-bonding area. The first and the second connectors are disposed on the body, and they can be pluggably connected to an external power source or other connectors. The LED chips are connected to the electrical input terminals in the first and the second connectors.
Inventors:
Yangmitsu
Kure Tak birch
Chen Waka
Hayashi Shigo
Xu Tetsu
Tsai Soura
Kure Tak birch
Chen Waka
Hayashi Shigo
Xu Tetsu
Tsai Soura
Application Number:
JP2013230835A
Publication Date:
May 24, 2016
Filing Date:
November 07, 2013
Export Citation:
Assignee:
隆達電子股▲ふん▼有限公司
International Classes:
H01L33/62; F21S2/00; F21V19/00; H01L33/64
Domestic Patent References:
| JP2008543064A | ||||
| JP2011511427A | ||||
| JP2012054402A | ||||
| JP2011142312A |
Attorney, Agent or Firm:
Mikio Yoshimiya