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Title:
照明装置
Document Type and Number:
Japanese Patent JP7383780
Kind Code:
B2
Abstract:
A lighting apparatus comprising a printed circuit board (110), a plurality of light sources (130) disposed on the PCB (110), a reflecting unit (120) disposed on the PCB (110), a resin layer (140) disposed on the reflecting unit (120) to cover the plurality of light sources (130); and an optical pattern layer (150) comprising a first optical layer (150B) disposed on the resin layer (140), a second optical layer (150A) spaced apart from the first optical layer (150B), a plurality of optical patterns (151) and a bonding pattern layer (153) that are disposed between the first optical layer (150B) and the second optical layer (150A), and a second spaced area (152) disposed around the optical patterns (151) and separating the bonding pattern layer (153) from the optical patterns (151).

Inventors:
Lee, Byung Young
Park, Mouryeong
Park, Gwangho
Kim, Chur Hong
Application Number:
JP2022182722A
Publication Date:
November 20, 2023
Filing Date:
November 15, 2022
Export Citation:
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Assignee:
LG Innotek Company Limited
International Classes:
F21V19/00; F21S2/00; G02B5/00; G02B5/02; H01L33/60; H01L33/62; F21W107/10
Domestic Patent References:
JP2009193955A
JP2003222714A
Foreign References:
WO2011025174A2
WO2007086347A1
Attorney, Agent or Firm:
Makoto Ono
Kennori Kanayama
Kazuki Shigemori
Hidehiko Ichikawa
Yoshikazu Iwase



 
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