Title:
複数のバネを備えた伸縮可能なリンクアセンブリ、およびそのリンクアセンブリを含むスライディングタイプ携帯電話用スライダーアセンブリ
Document Type and Number:
Japanese Patent JP4838311
Kind Code:
B2
Abstract:
Disclosed is a link assembly which includes a spring, a first link plate and a second link plate. The spring is formed with catching portions with a reduced outer diameter at both ends thereof. The first link plate includes one widthwise extending side that is formed with a spring fixing groove into which the catching portion positioned at one end of the spring is inserted and fixed. The second link plate includes one widthwise extending side that is formed with another spring fixing groove into which another catching portion positioned at the other end of the spring is inserted and fixed. Further, the first and second link plates are slid with respect to each other.
Inventors:
Lee Jang Woo
Application Number:
JP2008533233A
Publication Date:
December 14, 2011
Filing Date:
September 08, 2006
Export Citation:
Assignee:
Hi-Tech Parts Company Limited
International Classes:
F16F3/04; F16F1/06; F16F1/12; H04M1/02
Attorney, Agent or Firm:
Haruka International Patent Office