Title:
A liquefied hardening resin constituent and its use
Document Type and Number:
Japanese Patent JP6126837
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a liquid curable resin composition that is excellent in various physical properties such as heat resistance, and also that can be present as a liquid at room temperature even without substantially containing volatile components, such as an organic solvent or a diluent, and has a high fluidity, and to provide a sealing material and a semiconductor device employing the same.SOLUTION: A liquid curable resin composition comprises cyanate ester resin, inorganic filler and a basic compound, and is liquid.
Inventors:
Takuo Sugioka
Konosu Osamu
Teruhisa Fujibayashi
Atsushi Okada
Shusuke Kamata
Takaaki Wada
Yao Tomoyuki
Konosu Osamu
Teruhisa Fujibayashi
Atsushi Okada
Shusuke Kamata
Takaaki Wada
Yao Tomoyuki
Application Number:
JP2012279646A
Publication Date:
May 10, 2017
Filing Date:
December 21, 2012
Export Citation:
Assignee:
Nippon Shokubai Co., Ltd.
International Classes:
C08L79/00; C08K3/00; C08L35/00; C08L63/00; H01L23/29; H01L23/31
Domestic Patent References:
JP2000336246A | ||||
JP2013203930A | ||||
JP2013147638A | ||||
JP2009209191A | ||||
JP9102564A |
Attorney, Agent or Firm:
Atomi International Patent Office