Title:
液状樹脂組成物および該液状樹脂組成物を使用して作製した半導体装置
Document Type and Number:
Japanese Patent JP5428134
Kind Code:
B2
More Like This:
| WO/1994/029399 | STABILIZED CURABLE ADHESIVES |
| JPH0660300 | [Title of Invention] Adhesive Blend |
| WO/1996/016134 | PRESSURE SENSITIVE ADHESIVES AND DAMPING CONSTRUCTIONS |
Inventors:
Nobuki Tanaka
Mitsuru Okubo
Mitsuru Okubo
Application Number:
JP2007061320A
Publication Date:
February 26, 2014
Filing Date:
March 12, 2007
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
C09J4/00; C09J133/00; C09J201/02; H01L21/52; H01L23/373
Domestic Patent References:
| JP2006096834A | ||||
| JP2005171115A | ||||
| JP2003226854A | ||||
| JP2005105041A | ||||
| JP2005060439A | ||||
| JP2000290348A | ||||
| JP2003138226A | ||||
| JP2007031600A | ||||
| JP2007031599A | ||||
| JP2006206697A | ||||
| JP2006193625A | ||||
| JP2006206730A | ||||
| JP11092626A |
Foreign References:
| WO2005090510A1 |