A low temperature-proof resin composition and the superconducting wire material using it

Japanese Patent JP6021150

B2

PROBLEM TO BE SOLVED: To provide a low temperature resistant resin composition which has sufficient resistance at an extremely low temperature, can exhibit excellent adhesive strength and can be used as a superconductive wire material and to provide a superconductive wire material using the same.SOLUTION: There is provided a low temperature resistant resin composition which comprises: a phenolic hydroxyl group-containing aromatic polyamide resin represented by the following general formula (1); and boron nitride; magnesium oxide; aluminum nitride; or calcium carbonate as an inorganic filler. The low temperature resistant resin composition is used as a superconductive wire material at an extremely low temperature of -270°C to -190°C. Provided that m and n are average values showing 0.005≤n/(m+n)<1; m+n is larger than 0 and is a positive number of 200 or less; Arrepresents a divalent aromatic group, Arrepresents a divalent aromatic group having a phenolic hydroxyl group; and Arrepresents a divalent aromatic group.

JPS5534908	STRETCH FILM MANUFACTURING METHOD
JP3293898	RESIN COMPOSITION

Tomonori Watanabe
Shigeo Nagaya
Makoto Uchida
Yasumasa Akatsuka

JP2012266523A

November 09, 2016

December 05, 2012

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Chubu Electric Power Co., Inc.
NIPPON KAYAKU KABUSHIKI KAISHA

C08L77/00; C01G1/00; C08K3/00; C08L63/00; C09D5/25; C09D7/12; C09D163/00; C09D177/00; H01B3/30; H01B12/06; H01F5/06

JP2012216504A
JP2011198469A
JP11043610A

WO2011114665A1
US20120288725
WO2011007575A1
WO2010058734A1
WO2011136117A1

Hironobu Onda
Makoto Onda

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