Title:
LOW THERMAL EXPANDABLE RESIN COMPOSITION AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
Japanese Patent JP2016079368
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a resin composition consisting of an inorganic filler having excellent low thermal expandable property and an organic resin independent from specific organic resin matrix species.SOLUTION: The low thermal expandable resin composition is a resin composition by uniformly dispersing an ultra fine inorganic filler having average primary particle diameter of 1 to 50 nm (B) at its primary particle diameter level and further dispersing an inorganic filler having average particle diameter of 0.3 to 50 μm in an organic resin matrix (A) consisting of a curable resin (A1) or a thermoplastic resin (A2), where the blended amount of the ultra fine inorganic filler (B) is 2 to 30 mass% based on the resin matrix (A) and the total amount of the inorganic component combining the ultra fine inorganic filler (BI) and the inorganic filler (C) is 60 to 95 mass% of the resin composition.SELECTED DRAWING: None
Inventors:
FUJIMOTO KOJI
FUKUI TOSHIMI
FUKUI TOSHIMI
Application Number:
JP2014215512A
Publication Date:
May 16, 2016
Filing Date:
October 22, 2014
Export Citation:
Assignee:
KRI INC
International Classes:
C08L101/00; C08K3/00
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