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Title:
ホットスタンピング用潤滑離型剤
Document Type and Number:
Japanese Patent JP5542747
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a lubricating mold-release agent for hot stamping, which can facilitate processing and releasing by reducing friction caused between a material to be processed and a mold when a steel plate is subjected to hot stamping, thereby preventing the material and the mold from being damaged.SOLUTION: A solid lubricant-dispersed water-based lubricating mold-release agent is used when the steel plate is subjected to the hot stamping, wherein the lubricating mold-release agent comprises: a solid lubricant; a water-soluble polymer; carboxylate salt; a surfactant; and water.

Inventors:
Ikeda 修啓
Uda 紘助
Azuki bean island 明
Application Number:
JP2011128848A
Publication Date:
July 09, 2014
Filing Date:
June 09, 2011
Export Citation:
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Assignee:
Daido chemical industry incorporated company
Yokohama National University, National University Corporation
International Classes:
C10M173/02; C10M103/00; C10M103/06; C10M105/26; C10M105/70; C10M107/36; C10M129/34; C10M129/42; C10M129/50; C10M129/52; C10M143/06; C10M145/04; C10M145/14; C10M145/16; C10M145/36; C10M145/38; C10M145/40; C10M149/10; C10N10/02; C10N10/04; C10N10/08; C10N20/06; C10N30/06; C10N40/24; C10N40/36
Attorney, Agent or Firm:
Patent business corporation 3 Edakuni [Hajime] patent firm