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Title:
A luminescent device, a light implement for vehicles, and a stress relief part molding method
Document Type and Number:
Japanese Patent JP6135032
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a light emitting device which inhibits a translucent member from being broken and damaged even if a fixing member repeats heat expansion and contraction, and to provide a vehicle lamp fitting using the light emitting device and a stress releasing part mold method.SOLUTION: The light emitting device includes: a base part having a surface including a recessed part, a rear surface that is the opposite side of the surface, and a through hole which penetrates through a bottom surface of the recessed part and the rear surface; a translucent member which is fixed to the bottom surface of the recessed part covering the through hole; a semiconductor light-emitting element which passes through the through hole and emits light radiated to the translucent member; an optical system which condenses the light from the semiconductor light-emitting element and locally radiates the light to the translucent member; and a reflection member which is disposed in the recessed part while closely attaching to at least a part of the bottom surface of the recessed part and a part of a side surface of the translucent member. The reflection member includes a stress releasing part for suppressing heat stress which is generated in the reflection member by the light radiated from the semiconductor light-emitting element.

Inventors:
Takahiko Nozaki
Application Number:
JP2013029959A
Publication Date:
May 31, 2017
Filing Date:
February 19, 2013
Export Citation:
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Assignee:
Stanley Electric Co., Ltd.
International Classes:
F21V7/00; F21S8/10; F21V3/00; F21V3/04; F21V7/22; F21V29/10; H01S5/022
Domestic Patent References:
JP2012142187A
JP2010165834A
JP2012114468A
JP2011014587A
JP2011071404A
JP2013004802A
Attorney, Agent or Firm:
Kenzo Matsuura