Title:
Manufacturing method of light emitting device and light emitting module
Document Type and Number:
Japanese Patent JP6327232
Kind Code:
B2
Abstract:
A light emitting device includes a wiring board (10), a light emitting element (20), and a protection film (40). The wiring board (10) includes a base member (11), and positive and negative wiring layer parts (12). The positive and negative wiring layer parts (12) are arranged on or above the upper surface of the base member (11). The light emitting element (20) is mounted on the wiring layer parts in a flip-chip manner. The protection film (40) covers the base member (11), the wiring layer parts (12) and the light emitting element (20), and is formed of an inorganic material for serving as the exterior surface of the light emitting device (100). Each of the wiring layer parts (12) has a curved outer-side edge. The curvature of the outer-side edge is substantially constant.
Inventors:
Daisuke Kishikawa
Application Number:
JP2015213765A
Publication Date:
May 23, 2018
Filing Date:
October 30, 2015
Export Citation:
Assignee:
Nichia Corporation
International Classes:
H01L33/62; H01L33/54; H01L33/56
Domestic Patent References:
| JP2015500570A | ||||
| JP2008300580A | ||||
| JP2000294833A | ||||
| JP4107861U | ||||
| JP2013110353A | ||||
| JP2009532900A | ||||
| JP2007243076A | ||||
| JP2009105379A | ||||
| JP10308535A | ||||
| JP2013143559A | ||||
| JP2011204986A | ||||
| JP2013254937A | ||||
| JP2012099572A | ||||
| JP2013168528A | ||||
| JP2014220294A |
Foreign References:
| US20150194585 | ||||
| CN103441203A |
Attorney, Agent or Firm:
Toshisu Koji
Yasuhiro Toyosu
Yasuhiro Toyosu
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