Title:
磁性基板及びその製造方法、磁性基板と絶縁材の接合構造物、並びにその接合構造物を有するチップ部品
Document Type and Number:
Japanese Patent JP6512470
Kind Code:
B2
Abstract:
A chip component includes a magnetic substrate having ferrite layers, and an insulating layer disposed on the magnetic substrate and having an electrode disposed therein. An external electrode is connected to the electrode on the insulating layer. The magnetic substrate and the insulating layer have a chemical coupling structure formed on an interface therebetween. The chemical coupling structure includes Si—O—C or Si—O—N.
More Like This:
Inventors:
Lee Sa Young
Kwon Young Il
Ho Jin Ho
Kim Seung Han
Lee Kung Young
Kwon Young Il
Ho Jin Ho
Kim Seung Han
Lee Kung Young
Application Number:
JP2014169215A
Publication Date:
May 15, 2019
Filing Date:
August 22, 2014
Export Citation:
Assignee:
Samsung Electro-Mechanics Co., Ltd.
International Classes:
H01F17/04; H01F1/34; H01F17/00; H01F27/32; H01F37/00; H01F41/02
Domestic Patent References:
| JP2006253320A | ||||
| JP3090371U | ||||
| JP3173410A | ||||
| JP2006156499A | ||||
| JP2005213115A | ||||
| JP2013140929A |
Attorney, Agent or Firm:
Longhua International Patent Service Corporation