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Title:
The magnetic field sensor integrated circuit which has one ferromagnetism material
Document Type and Number:
Japanese Patent JP6270900
Kind Code:
B2
Abstract:
A magnetic field sensor includes: a lead frame having a first surface, a second opposing surface, at least one slot extending from the first surface to the second surface in a vertical direction, and a plurality of leads; a semiconductor die having a first surface in which a magnetic field sensing element is disposed and a second opposing surface attached to the first surface of the lead frame, wherein the at least one slot is aligned with the semiconductor die in the vertical direction; a non-conductive mold material enclosing the die and at least a portion of the lead frame, the non-conductive mold material having a first surface adjacent to the first surface of the semiconductor die and a second opposing surface adjacent to the second surface of the lead frame, wherein the non-conductive mold material comprises a protrusion having tapered side walls extending from the second surface of the non-conductive mold material; and a conductive coil secured to the second surface of the non-conductive mold material and positioned concentrically with respect to the protrusion of the non-conductive mold material, wherein the conductive coil is configured to operate as a back bias magnet to provide a magnetic field used to detect movement of a target.

Inventors:
Vig, Ravi
Taylor, William Pea
David, Paul
Scheller, Pea Curl
Friedrich, Andreas P.
Rho, Marie-Adeleide
Burdett, Eric
Eric, showmaker
Doug, Michael Sea
Application Number:
JP2016084148A
Publication Date:
January 31, 2018
Filing Date:
April 20, 2016
Export Citation:
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Assignee:
Allegro Microsystems LRC
International Classes:
G01R33/02; G01R33/06; H01L23/29; H01L23/31; H01L25/00; H01L43/02; H01L43/04
Domestic Patent References:
JP590918U
Foreign References:
US20120013333
Attorney, Agent or Firm:
Shinjiro Ono
Yasushi Kobayashi
Shigeo Takeuchi
Osamu Yamamoto
Kenichi Torii