Title:
A manufacturing method of a CMP pad conditioner and the CMP pad conditioner concerned
Document Type and Number:
Japanese Patent JP6014835
Kind Code:
B2
Inventors:
Maeda Mikiyo
Takashi Nakamura
Takeshi Katayama
Akihiro Shimizu
Kazuto Soma
Daisuke Ikuno
Tsutomu Morikawa
Nakaide Takuo
Daiki Oshima
Takashi Nakamura
Takeshi Katayama
Akihiro Shimizu
Kazuto Soma
Daisuke Ikuno
Tsutomu Morikawa
Nakaide Takuo
Daiki Oshima
Application Number:
JP2011273901A
Publication Date:
October 26, 2016
Filing Date:
December 14, 2011
Export Citation:
Assignee:
Teikoku Aeon Co., Ltd.
Noritake Company Limited
Osaka Prefectural Industrial Technology Research Institute
Noritake Company Limited
Osaka Prefectural Industrial Technology Research Institute
International Classes:
B24B53/12; B24B37/00; B24B53/00; H01L21/304
Domestic Patent References:
JP9239663A |
Other References:
森河 務、横井昌幸,”非晶質めっきとその応用”、[online]、1998年5月6日,2015年10月22日,5.1、5.3欄,森河 務、横井昌幸、江口晴一郎:科学と工業,65(5),213-221(1991),URL,http://tri-osaka.jp/fields/kinpyou/surface/morikawa/R3/P3.html
Attorney, Agent or Firm:
Harakenzo world patent & trademark
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