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Title:
ADHESIVE STRUCTURE, METHOD FOR MANUFACTURING ADHESIVE STRUCTURE AND PEELING METHOD
Document Type and Number:
Japanese Patent JP2017193169
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an adhesive structure obtained by firmly bonding a thermoplastic hot melt adhesive to concrete, an adhesive structure obtained by firmly bonding concrete to various members such as a polyester-based member, a vinyl chloride member, an epoxy-based member, a woody member, a gypsum board or glass, a method for manufacturing them by electromagnetic induction heating, and a peeling method capable of easily peeling and dismantling them by electromagnetic induction heating.SOLUTION: The above described problem is solved by an adhesive structure in which: a laminate (X) has a concrete layer (E) and a primer layer (D), and a laminate (Y) has a metal layer (A) and a thermoplastic hot melt adhesive layer (C1); and the primer layer (D) side of the laminate (X) and the thermoplastic hot melt adhesive layer (C1) side of the laminate (Y) are bonded together.SELECTED DRAWING: Figure 1

Inventors:
ISHIGURO HIDEYUKI
EGAWA RYO
YOSHIKAWA TAKESHI
Application Number:
JP2017062239A
Publication Date:
October 26, 2017
Filing Date:
March 28, 2017
Export Citation:
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Assignee:
TOYO INK SC HOLDINGS CO LTD
International Classes:
B32B13/06; C09J5/06; C09J7/02; C09J201/00
Domestic Patent References:
JP2004027718A2004-01-29
JP2015136811A2015-07-30
JP2005097360A2005-04-14
JP2001026915A2001-01-30
JP2012071517A2012-04-12
JPS3516976Y1
JPH10306264A1998-11-17
JPH04118232A1992-04-20