Title:
A manufacturing method of an adhesive composition, an adhesion sheet, and a semiconductor device
Document Type and Number:
Japanese Patent JP6029536
Kind Code:
B2
Inventors:
Sayaka Tsuchiyama
Naoki Saeki
Yuichiro Azuma
Hideaki Suzuki
Naoki Saeki
Yuichiro Azuma
Hideaki Suzuki
Application Number:
JP2013111974A
Publication Date:
November 24, 2016
Filing Date:
May 28, 2013
Export Citation:
Assignee:
LINTEC CORPORATION
International Classes:
C09J133/00; C09J5/00; C09J7/00; C09J7/02; C09J11/04; C09J163/00; C09J163/10; H01L21/301; H01L21/52; H01L25/04; H01L25/18
Domestic Patent References:
| JP2009127043A | ||||
| JP2009127042A | ||||
| JP2008133330A | ||||
| JP2007314604A | ||||
| JP6136244A | ||||
| JP2013194103A | ||||
| JP2013183000A |
Attorney, Agent or Firm:
Maeda/Suzuki International Patent Corporation