Title:
A manufacturing method of the adhesives sheet for the semiconductor device manufacture with a vamp electrode, and a semiconductor device
Document Type and Number:
Japanese Patent JP6112013
Kind Code:
B2
Abstract:
An adhesive sheet for production of a semiconductor device with bump electrode, including a soft film and an alkali-soluble adhesive film formed on the soft film is capable of exposing the bump electrode without imparting damage to the bump electrode, and then wet etching of an adhesive on bump tops using an aqueous alkali solution makes it possible to put into a state where no adhesive exists on the bump tops, thus enabling the production of a semiconductor device which is excellent in connection reliability after flip chip packaging.
Inventors:
Kazuyuki Matsumura
Koichi Fujimaru
Toshio Nonaka
Koichi Fujimaru
Toshio Nonaka
Application Number:
JP2013528861A
Publication Date:
April 12, 2017
Filing Date:
May 21, 2013
Export Citation:
Assignee:
TORAY INDUSTRIES,INC.
International Classes:
C09J7/22; C09J7/35; C09J11/04; C09J11/06; C09J163/00; C09J179/08; H01L21/60; H01L23/29; H01L23/31
Domestic Patent References:
| JP2010258239A | ||||
| JP2004319823A | ||||
| JP2009277818A | ||||
| JP2005317613A | ||||
| JP2011171586A |
Foreign References:
| WO2012005079A1 | ||||
| WO2011049011A1 | ||||
| WO2010024087A1 |