Title:
ALUMINUM PLATING SOLUTION, PRODUCTION METHOD OF ALUMINUM PLATING FILM, AND ALUMINUM POROUS BODY
Document Type and Number:
Japanese Patent JP2017137517
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an aluminum plating solution enabling an aluminum film having a smooth surface and excellent elongation to be continuously produced.SOLUTION: The aluminum plating solution is provided that enables aluminum to be electro-deposited on a surface of a substrate. The aluminum plating solution includes, as components, an aluminum halogenide (A), any one or more type of compounds (B) selected from a group consisting of an alkyl imidazolium halogenide, an alkyl pyridinium halogenide, and a urea compound, and an organic compound (C) that is an organic compound containing a benzene ring, is a solid at a room temperature, and has constituent elements which are any one or more type selected from the group consisting of hydrogen, carbon and halogen atoms, a blend ratio of the component (A) and the component (B) being in the range of 1:1-3:1 by a molar ratio, and the concentration of the component (C) being 0.10 g/L or more and 20 g/L or less.SELECTED DRAWING: None
Inventors:
GOTO KENGO
HOSOE AKIHISA
NISHIMURA JUNICHI
OKUNO KAZUKI
KIMURA KOTARO
SAKAIDA HIDEAKI
MOTOMURA JUNICHI
HOSOE AKIHISA
NISHIMURA JUNICHI
OKUNO KAZUKI
KIMURA KOTARO
SAKAIDA HIDEAKI
MOTOMURA JUNICHI
Application Number:
JP2014128829A
Publication Date:
August 10, 2017
Filing Date:
June 24, 2014
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES
International Classes:
C25D3/66; C25D1/08
Attorney, Agent or Firm:
Masami Sakai
Norio Kagami
Yoshikuni Suda
Norio Kagami
Yoshikuni Suda