Title:
高周波信号線路及び信号線路付き基材層の製造方法
Document Type and Number:
Japanese Patent JP5862774
Kind Code:
B2
Abstract:
A high-frequency signal line includes a first base layer having flexibility, a linear signal line provided on the first base layer and including a first line portion having a first width and a second line portion having a second width greater than the first width, and a first reinforcing conductor provided on the first base layer along the first line portion.
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Inventors:
Tokiko Kato
Satoshi Ishino
Jun Sasaki
Satoshi Ishino
Jun Sasaki
Application Number:
JP2014522537A
Publication Date:
February 16, 2016
Filing Date:
June 13, 2013
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
H01P11/00; H01P3/08
Domestic Patent References:
| JP2011147083A | 2011-07-28 | |||
| JP2005228795A | 2005-08-25 |
Foreign References:
| WO2011007660A1 | 2011-01-20 |
Attorney, Agent or Firm:
Patent business corporation Profic patent office