Title:
A manufacturing method of a cable with a resin mold
Document Type and Number:
Japanese Patent JP6281461
Kind Code:
B2
Abstract:
A method for producing a cable with a resin mold including a cable section comprising an electric wire and a sheath comprising a synthetic resin covering the electric wire, and a resin mold section into which a portion of the sheath is molded by a resin is provided. A portion of the cable section is received in a receiving space in a die formed with a molten resin inlet, an inflow passage, and a resin reservoir therein. A molten resin is injected from the inlet into the receiving space. A portion of the injected molten resin flows through the inflow passage and is retained in the resin reservoir. The portion of the sheath is molten by heat of the molten resin. The molten resin is solidified to thereby form a molded resin product. Its unnecessary portion solidified in the resin reservoir is removed from the molded resin product.
Inventors:
Yukio Ikeda
Application Number:
JP2014199867A
Publication Date:
February 21, 2018
Filing Date:
September 30, 2014
Export Citation:
Assignee:
Hitachi Metals Co., Ltd.
International Classes:
H01B13/00; G01P1/02; G01P3/488
Domestic Patent References:
| JP200019185A | ||||
| JP2002367751A |
Attorney, Agent or Firm:
Tadao Hirata
Kenji Tsunoda
Yuji Iwanaga
Keiko Nakamura
Endo Wako
Takashi Nomiyama
Hiroyuki Ito
Kenji Tsunoda
Yuji Iwanaga
Keiko Nakamura
Endo Wako
Takashi Nomiyama
Hiroyuki Ito