Title:
半導体加工装置用セラミック被覆部材の製造方法
Document Type and Number:
Japanese Patent JP4643478
Kind Code:
B2
Abstract:
Producing a ceramic coating member for a semiconductor processing apparatus with a purpose of improving the resistance of members and parts disposed inside of vessels such as semiconductor processing devices for conducting plasma etching treatment in a strong corrosive environment and as a means for solution, forming a porous layer by irradiating an oxide of an element in Group IIIa of the Periodic Table to be coated directly or through an undercoat on the surface of the substrate of a metal or non-metal and further forming a secondary recrystallized layer of the oxide on the porous layer through an irradiation treatment of a high energy such as electron beam and laser beam.
Inventors:
Yoshio Harada
Junichi Takeuchi
Ryo Yamazaki
Keigo Kobayashi
Junichi Takeuchi
Ryo Yamazaki
Keigo Kobayashi
Application Number:
JP2006076197A
Publication Date:
March 02, 2011
Filing Date:
March 20, 2006
Export Citation:
Assignee:
Tocalo Co., Ltd.
International Classes:
C23C4/18; C23C4/06; C23C4/10; C23C26/00; C23C28/00; H01L21/3065
Domestic Patent References:
| JP2005256098A | ||||
| JP2001164354A | ||||
| JP62253758A | ||||
| JP4276059A | ||||
| JP58192661A | ||||
| JP2002080954A | ||||
| JP10004083A | ||||
| JP2007138302A | ||||
| JP2007131951A | ||||
| JP2007070175A |
Attorney, Agent or Firm:
Junzo Ogawa
Morio Nakamura
Morio Nakamura