Title:
加熱接合用材料の製造方法、及び電子部品の接合方法
Document Type and Number:
Japanese Patent JP5607786
Kind Code:
B2
Abstract:
A material is for thermal bonding by metal fine particle sintering mediated by a metal sintered film, such that shorts do not occur readily between bonded sections, and bonding strength is higher than that achieved by plating or sputtering. The material is obtained by dispersing metal fine particles in an organic compound dispersion medium that melts or softens through heating at a temperature higher than 30° C., and is interposed between metal members, semiconductor members or ceramic members. The material includes 60 wt % or more of the organic compound dispersion medium containing one or more types of a polyol having a melting point or softening point of 30° C. or higher and having two or more hydroxyl groups in the molecule, and 80 wt % or more of the metal fine particles that have an average particle size of primary particles ranging from 5 to 200 nm.
Inventors:
Toshiaki Asada
Fujiwara Hidemichi
Fujiwara Hidemichi
Application Number:
JP2013099637A
Publication Date:
October 15, 2014
Filing Date:
May 09, 2013
Export Citation:
Assignee:
The Furukawa Electric Co., Ltd.
International Classes:
B22F7/00; B22F1/0545; B22F1/107; B22F7/04; C09J1/00; C09J11/06; H01B1/00; H01B1/22; H01K3/32; H01L21/52
Attorney, Agent or Firm:
Shirasaka 1
Inside Atsushi
Inside Atsushi