A manufacturing method of a circuit board using the copper paste and this containing a copper composite particle and this

Title:

A manufacturing method of a circuit board using the copper paste and this containing a copper composite particle and this

Document Type and Number:

Japanese Patent JP6175304

Kind Code:

B2

Abstract:

PROBLEM TO BE SOLVED: To provide a copper composite particle which, when used for copper paste, can impart good conductivity to a conductor obtained by sintering of the copper paste, copper paste comprising the same, and a method of producing a circuit board using the same.SOLUTION: A copper composite particle 3 comprises a copper particle 4, and formic acid copper 5 deposited on at least part of a surface 4a of the copper particle 4.

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Inventors:

Nishiwaki Isao

Application Number:

JP2013160072A

Publication Date:

August 02, 2017

Filing Date:

August 01, 2013

Export Citation:

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Assignee:

Fujikura Ltd.

International Classes:

B22F1/02; B22F1/00; B22F9/00; H01B1/00; H01B1/22; H01B5/00; H01B13/00; H05K1/09

Domestic Patent References:

JP2011122177A

Attorney, Agent or Firm:

Hiroaki Aoki
Yasuo Morimura

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