Title:
A manufacturing method of circuit connection material, the connection structure of a circuit component, and the connection structure of a circuit component
Document Type and Number:
Japanese Patent JP6146302
Kind Code:
B2
Abstract:
The present invention is a circuit connection material for electrically connecting opposing circuit electrodes, comprising an adhesive composition and conductive particles. The conductive particles are aggregated particles with an average particle diameter of 5-20µm, having a metal or nickel core with a Vickers hardness of 300-1000 and an outermost layer of a precious metal coating the core. Unevennesses are formed on the surface of the conductive particles.
Inventors:
Takashi Nakazawa
Mitsugu Fujinawa
Kenzo Takemura
Yusuke Iijima
Mitsugu Fujinawa
Kenzo Takemura
Yusuke Iijima
Application Number:
JP2013515048A
Publication Date:
June 14, 2017
Filing Date:
April 10, 2012
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
H01R11/01; C09J4/00; C09J9/02; C09J11/04; C09J163/00; H01B1/00; H01B1/22; H01R43/00
Domestic Patent References:
| JP2009277769A | ||||
| JP63308880A | ||||
| JP2006228475A |
Foreign References:
| WO2009057612A1 |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Hiroyuki Hirano
Hiroshi Abe
Kazuyuki Yoshizumi
Yoshinori Shimizu
Hiroyuki Hirano
Hiroshi Abe
Kazuyuki Yoshizumi
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