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Title:
COPPER POWDER, METHOD FOR PRODUCING COPPER POWDER AND CONDUCTIVE PASTE
Document Type and Number:
Japanese Patent JP2017101286
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a copper powder that has a low TAP density and can be used suitably for conductive paste and a method of producing the same.SOLUTION: A copper powder has an average particle diameter of 0.05-5.0 μm as measured with a laser diffraction scattering type particle-size distribution measuring device, and a TAP density of 3.0 g/cmor less.SELECTED DRAWING: None

Inventors:
MOTOMURA KOICHI
KANESHIRO MASAKI
INOUE KENICHI
ENDO KEIICHI
Application Number:
JP2015235297A
Publication Date:
June 08, 2017
Filing Date:
December 02, 2015
Export Citation:
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Assignee:
DOWA HOLDINGS CO LTD
International Classes:
B22F1/00; B22F9/24; C22C9/00; H01B1/00; H01B1/22; H01B5/00; H01B13/00
Domestic Patent References:
JP2007254846A2007-10-04
JP2008285761A2008-11-27
JPH04214774A1992-08-05
JP2014005188A2014-01-16
Foreign References:
WO2015115139A12015-08-06



 
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