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Patent Searching and Data


Title:
Conductive paste and method for producing conductive paste
Document Type and Number:
Japanese Patent JP6329144
Kind Code:
B2
Abstract:
Provided is a conductive paste capable of improving coating properties, capable of efficiently arranging conductive particles upon electrodes, and capable of improving conduction reliability between electrodes. This conductive paste includes a thermosetting component and a plurality of conductive particles. The thermosetting component contains a thermosetting compound that is solid at 25°C and a thermosetting agent. The thermosetting compound that is solid at 25°C is scattered as particles in the conductive paste.

Inventors:
Hitoshi Yamagiwa
Kubota Keishi
Hideaki Ishizawa
Application Number:
JP2015524523A
Publication Date:
May 23, 2018
Filing Date:
May 01, 2015
Export Citation:
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Assignee:
Sekisui Chemical Co.,Ltd.
International Classes:
H01B1/22; C08K3/00; C08L101/00; C09J9/02; C09J163/00; C09J201/00; H01B5/16; H01B13/00; H01R11/01; H01R43/00
Domestic Patent References:
JP201456816A
Attorney, Agent or Firm:
Patent business corporation Miya saki, table of contents patent office