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Patent Searching and Data


Title:
導電膜形成用組成物、導電膜の製造方法、ギ酸銅錯体
Document Type and Number:
Japanese Patent JP6727174
Kind Code:
B2
Abstract:
To provide a conductive film forming composition having excellent low temperature sinterability, a method for producing a conductive film using the conductive film forming composition, and a copper formate complex contained in the conductive film forming composition.SOLUTION: A conductive film forming composition contains a copper formate complex composed of copper formate and a polyethyleneimine derivative having a polyester chain, and copper formate particles.SELECTED DRAWING: None

Inventors:
Kazufumi Komura
Application Number:
JP2017166478A
Publication Date:
July 22, 2020
Filing Date:
August 31, 2017
Export Citation:
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Assignee:
FUJIFILM Corporation
International Classes:
H01B1/22; B32B27/18; B32B27/36; C07F1/08; C08G63/91; C08K5/098; C08L79/02; C09D5/24; C09D7/61; C09D179/02; H01B13/00
Domestic Patent References:
JP2016138297A
JP2011241309A
JP7207012A
JP2014071963A
Foreign References:
US20150056426
KR1020170009467A
Attorney, Agent or Firm:
Haruko Sanwa
Hideaki Ito
Fumio Mitsuhashi