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Title:
COMPOSITION FOR FORMING HEAT INSULATING LAYER AND MANUFACTURING METHOD OF HEAT INSULATING MATERIAL
Document Type and Number:
Japanese Patent JP2018111760
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a composition for forming a heat insulating layer excellent in temporal stability during storage, and forming a heat insulating layer consisting of an expanded capsule-containing resin film formed by expanding a thermal expanding microcapsule by heating the film on a surface of a substrate at high efficiency and a manufacturing method of a heat insulating material.SOLUTION: A composition for forming a heat insulating layer contains 18 to 40 mass% of a resin for forming a film, 5 to 22 mass% of a thermal expanding microcapsule with expansion initiation temperature of 80°C to 150°C, 7 to 20 mass% of alcohol and 30 to 56 mass% of water based on 100 mass% of total thereof.SELECTED DRAWING: Figure 1

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Inventors:
SEMMA HIROKAZU
TANAZAWA NORITAKA
Application Number:
JP2017002152A
Publication Date:
July 19, 2018
Filing Date:
January 10, 2017
Export Citation:
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Assignee:
DAISEN KK
TOKYO PRINTING INK MFG CO LTD
International Classes:
C09D201/00; B32B7/02; C08K9/10; C08L75/04; C08L101/00; C09D7/40; C09D175/04
Domestic Patent References:
JP2002256251A2002-09-11
JP2008238461A2008-10-09
JP2004345267A2004-12-09
JPS6239674A1987-02-20
JP2007063708A2007-03-15
JP2015104848A2015-06-08
Attorney, Agent or Firm:
Kiyoshi Kojima
Yasuyuki Hiraiwa
Masaru Suzuki



 
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