Title:
A manufacturing method of copper foil with a career, a layered product, and a printed wired board, and a manufacturing method of electronic equipment
Document Type and Number:
Japanese Patent JP6200042
Kind Code:
B2
Abstract:
Provided herein is a carrier-attached copper foil having desirable fine circuit formability. The carrier-attached copper foil includes a carrier, an interlayer, and an ultrathin copper layer in this order. The maximum ridge height Sp as measured with a laser microscope according to ISO 25178 on the surface of the carrier-attached copper foil on the side of the ultrathin copper layer is 0.193 to 3.082 μm.
Inventors:
Nobuaki Miyamoto
Application Number:
JP2016140888A
Publication Date:
September 20, 2017
Filing Date:
July 15, 2016
Export Citation:
Assignee:
JX Nippon Mining & Metals Co., Ltd.
International Classes:
C25D1/04; B32B15/01; B32B15/04; C25D5/16; C25D7/06; H05K1/09
Domestic Patent References:
| JP2016089193A | ||||
| JP2014131808A | ||||
| JP2014208910A | ||||
| JP2015061938A |
Attorney, Agent or Firm:
Axis International Patent Business Corporation
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