Title:
Manufacturing method of copper foil with carrier, copper foil with carrier, printed wiring board, printed circuit board, copper-clad laminate, and printed wiring board
Document Type and Number:
Japanese Patent JP6329727
Kind Code:
B2
Inventors:
Misato Honda
Tomoki Kobiki
Yuta Nagaura
Tomoki Kobiki
Yuta Nagaura
Application Number:
JP2013043587A
Publication Date:
May 23, 2018
Filing Date:
March 06, 2013
Export Citation:
Assignee:
JX Nippon Mining & Metals Co., Ltd.
International Classes:
B32B15/01; C23C28/00; H05K1/09
Domestic Patent References:
| JP2010201804A | ||||
| JP2007022091A | ||||
| JP2007314855A |
Foreign References:
| WO2002024444A1 |
Attorney, Agent or Firm:
Axis International Patent Business Corporation
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